3D Solder Paste Inspector by Unicomp Technology. Auto-search and
inspect also rectify offset base on PCB MARK;Exact and reliable
hard system provide creditable data and long life;
Features:
300mm×300mm Full area to meet using request;
Auto-search and inspect also rectify offset base on PCB MARK;
Inspection multi goal by one key;
Auto compensation and correct warp as well as distortion so that
get reliable solder paste;
Strong SPC analyze software for data statistic;
Warning and building CP、CPK、X-BAR、R-CHART、SIGMA histogram
R&C&S&P distributing chart、straight、trend chart、control
chart automatically
Inspection for section slip and analyze after scanning image, as
well as 2D;
Exact and reliable hard system provide creditable data and long
life;
Multifunction test for over solder paste;
Auto-save the test data and build SPC report so that review in
future;
Programmed test system and operation with quick and view;Others:
Encapsulation IC and measure for blank diction PCB;
Measure steel mesh for through hole and shape;
Measure thickness for solder tray and silk-screen pattern;
Provide forecast for pressure、optimize printing processing;
Encapsulation chip、same plainness for accessories;
Measure dimension and shape for BGA/CSP;
Working Principle
Principle Show
Reflection laser so surface of object by laser head. then reflect
to lens by surface of different heigh,transform into data by image
processing
Software Analyse
Test Effection
Simple Three Operation Steps
Allocation
Point
Selecting Test
Results
Parameters
Tiptop measure precision(Z) | Height(Z):0.5m |
Repeat precision | Height：below1.2m,Volume:below1% |
Zoom multiple | 50X |
Optics inspection system | Germany IMAGING CCD Camera |
Laser system | Laser module with
glowing |
